Title:
METHOD OF PRODUCING POLYURETHANE AND METHOD OF PRODUCING OVERCOAT FILM FOR FLEXIBLE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/246154
Kind Code:
A1
Abstract:
Provided is a method of producing a polyurethane capable of giving a curable composition from which it is possible to form a flexible wiring board that exhibits low warpage and suppresses the disconnection of wiring. A polyurethane is produced by reacting a polyisocyanate compound I with a first polyol compound H1, a second polyol compound H2, and a third polyol compound H3. The first polyol compound H1 has a higher aromatic ring density than the second polyol compound H2, and the first polyol compound H1 and the second polyol compound H2 each have a higher reaction rate constant for a urethane bond-forming reaction than the third polyol compound H3. All of the polyisocyanate compound I, all of the first polyol compound H1 and some of the third polyol compound H3 are mixed and a polymerization reaction is induced to obtain an intermediate polymer, and then all of the second polyol compound H2 and the remainder of the third polyol H3 are added to the intermediate polymer and another polymerization reaction is induced.
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Inventors:
ISHIBASHI YOSHITAKA (JP)
KIMURA KAZUYA (JP)
KIMURA KAZUYA (JP)
Application Number:
PCT/JP2020/016908
Publication Date:
December 10, 2020
Filing Date:
April 17, 2020
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08G59/42; C08G18/08; C08G18/12; C08G18/32; C08G18/66; C08G18/83
Domestic Patent References:
| WO2017110326A1 | 2017-06-29 | |||
| WO2017110591A1 | 2017-06-29 |
Foreign References:
| JP2009280686A | 2009-12-03 | |||
| JP2014189746A | 2014-10-06 | |||
| JP2008208281A | 2008-09-11 | |||
| JP2008201877A | 2008-09-04 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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