Title:
METHOD FOR PRODUCING PRINTED BOARD AND PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2007/001008
Kind Code:
A1
Abstract:
A method for mass producing printed boards exhibiting high conductivity at low cost while suppressing pinholes, in which method the printed board can be formed in a pattern of thin lines while reducing environmental load. A photosensitive material for printed boards obtained by such production method, and a photosensitive material satisfying both plating progressiveness and pressure resistance are provided. An emulsion layer provided on a support and containing a silver salt emulsion is exposed and developed to form a metal silver portion and a light transmitting portion. Furthermore, the metal silver portion is subjected to physical phenomenon and/or a plating process thus forming a conductive metal portion where conductive metal particles are supported by the metal silver portion.
Inventors:
ICHIKI AKIRA
NAKAHIRA SHINICHI
KUSUOKA MAKOTO
NAKAHIRA SHINICHI
KUSUOKA MAKOTO
Application Number:
PCT/JP2006/312834
Publication Date:
January 04, 2007
Filing Date:
June 27, 2006
Export Citation:
Assignee:
FUJIFILM CORP (JP)
ICHIKI AKIRA
NAKAHIRA SHINICHI
KUSUOKA MAKOTO
ICHIKI AKIRA
NAKAHIRA SHINICHI
KUSUOKA MAKOTO
International Classes:
H05K3/18; G03C1/00
Foreign References:
| JP2000106481A | 2000-04-11 | |||
| JP2004253329A | 2004-09-09 | |||
| JP2004125983A | 2004-04-22 |
Attorney, Agent or Firm:
OGURI, Shohei et al. (7-13 Nishi-Shimbashi 1-chom, Minato-ku Tokyo 03, JP)
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