Title:
METHOD FOR PRODUCING REDUCED-THICKNESS ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO2005013353
Kind Code:
A3
Abstract:
The invention relates to a method for producing reduced-thickness electronic components. The inventive method consists in placing at least one electronic component (1) by the active face thereof provided with electric contacts (10, 11) on the top face (3) of a support (2) which is provided with electric contacts (5, 6) and with connection jacks (7, 8) on the lower face thereof. Said connection jacks are electrically connected to the electric contacts (5, 6) on the top face of said support by applying a deformable adhesive film (19) to the free external surface of the component (1) and to the top surface (3) of the support and by thinning the top surface of the electronic component, which is opposite to the active surface (12). Said invention can be used for electronic engineering.
Inventors:
PENTOVELIS GEORGIOS (FR)
MENAGE PHILIPPE (FR)
DUVAL PASCAL (FR)
BUREAU JEAN-MARC (FR)
MENAGE PHILIPPE (FR)
DUVAL PASCAL (FR)
BUREAU JEAN-MARC (FR)
Application Number:
PCT/FR2004/001642
Publication Date:
July 28, 2005
Filing Date:
June 28, 2004
Export Citation:
Assignee:
TEMEX (FR)
PENTOVELIS GEORGIOS (FR)
MENAGE PHILIPPE (FR)
DUVAL PASCAL (FR)
BUREAU JEAN-MARC (FR)
PENTOVELIS GEORGIOS (FR)
MENAGE PHILIPPE (FR)
DUVAL PASCAL (FR)
BUREAU JEAN-MARC (FR)
International Classes:
H01L21/60; H01L23/31; H01L23/498; H01L23/552; H03H3/08; H01L23/66; (IPC1-7): H03H3/08; H01L23/31; H01L23/552
Foreign References:
| DE10136743A1 | 2003-02-13 | |||
| EP1137066A2 | 2001-09-26 | |||
| EP1093159A1 | 2001-04-18 |
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