Title:
METHOD FOR PRODUCING RESIN BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/101011
Kind Code:
A1
Abstract:
This method for producing a resin bonded body, in which a bonded body to which molded bodies formed from fluororesin materials are bonded is produced, includes: a step for forming a first resin assembly (51) of a shape having an accommodation portion (51a) from a first fluororesin material that is capable of gelling and maintaining shape even at or above the melting point thereof; a step for accommodating a second resin assembly (53) composed of a second fluororesin material that melts and becomes liquid at or above the melting point thereof within the accommodation portion (51a); and a step for heating the first resin assembly (51) having the second resin assembly (53) disposed in the accommodation portion (51a) to or above the melting point of the first fluororesin material and the second fluororesin material before cooling the first resin assembly (51), changing the first resin assembly (51) into a first resin molded body and the second resin assembly (53) into a second resin molded body, and bonding the first and second resin molded bodies.
Inventors:
SUENAGA HIROSHI (JP)
MATSUSHITA HIROYUKI (JP)
MATSUSHITA HIROYUKI (JP)
Application Number:
PCT/JP2022/044573
Publication Date:
June 08, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
ASAHI YUKIZAI CORP (JP)
International Classes:
B29C65/02; B29C65/70; B29C69/02; F16K7/12
Foreign References:
| JPH10138346A | 1998-05-26 | |||
| JP2011226610A | 2011-11-10 | |||
| JPS5410378A | 1979-01-25 | |||
| JP2016211618A | 2016-12-15 | |||
| JP2016065560A | 2016-04-28 |
Attorney, Agent or Firm:
TAMBA, Masataka et al. (JP)
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