Title:
METHOD FOR PRODUCING RESIN-EQUIPPED METAL FOIL
Document Type and Number:
WIPO Patent Application WO/2019/142747
Kind Code:
A1
Abstract:
Provided is a method which makes it possible to stably mass-produce a resin-equipped metal foil which has a resin layer which contains a homogeneous fluoropolymer exhibiting few defects (streaks, foreign matter, and the like), and exhibiting a low dielectric constant and low dielectric tangent. A method for producing a resin-equipped metal foil having a resin layer on the surface of a metal foil, the method involving: formation of a wet film on the surface of a metal foil by performing dispersion processing of a powder dispersion fluid which contains a tetrafluoroethylene polymer powder and a solvent having a boiling point of 80°C or higher, transfer processing of the powder dispersion fluid, and coating processing onto the surface of the metal foil to which the powder dispersion fluid was transferred; removal of the solvent from the wet film by keeping the wet film at the solvent volatilization temperature; and next, formation of a resin layer containing the tetrafluoroethylene polymer on the surface of the metal foil, by sintering the tetrafluoroethylene polymer at a temperature which exceeds the volatilization temperature.
Inventors:
YAMABE ATSUMI (JP)
SHIMODA HIROSHI (JP)
SATO YUSUKE (JP)
SHIMODA HIROSHI (JP)
SATO YUSUKE (JP)
Application Number:
PCT/JP2019/000763
Publication Date:
July 25, 2019
Filing Date:
January 11, 2019
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B05D7/14; B05D3/02; B05D7/24; H05K1/03
Domestic Patent References:
| WO2017222027A1 | 2017-12-28 | |||
| WO2010114033A1 | 2010-10-07 | |||
| WO2016017801A1 | 2016-02-04 | |||
| WO2016159102A1 | 2016-10-06 | |||
| WO2011010672A1 | 2011-01-27 |
Foreign References:
| JP2002239447A | 2002-08-27 | |||
| JP2009001745A | 2009-01-08 |
Attorney, Agent or Firm:
SENMYO Kenji et al. (JP)
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