METHOD FOR PRODUCING RESIN MOLDED ARTICLE

Title:

METHOD FOR PRODUCING RESIN MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2015/025592

Kind Code:

A1

Abstract:

This method for producing a resin molded article is characterized in that a curable resin composition containing an organosilicon compound is molded and cured with use of a molding die that is surface-treated with a baking-type mold release agent containing a silicone. The organosilicon compound used for a resin molded article according to the present invention can be at least one compound that is selected from the group consisting of organic silane compounds, organo-modified siloxane compounds and silicon-modified acrylic compounds. The present invention is able to provide a method for producing a resin molded article, which exhibits excellent scale adhesion prevention effect and scale removal effect for a long period of time.

Inventors:

OTANI KAZUO (JP)
MIURA KENJI (JP)

Application Number:

PCT/JP2014/065443

Publication Date:

February 26, 2015

Filing Date:

June 11, 2014

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)

International Classes:

B29C39/02; B29C33/64; B29C70/06

Foreign References:

JPS50137202A	1975-10-31
JPS62174117A	1987-07-30
JP2007072197A	2007-03-22
JP2003510201A	2003-03-18