Title:
METHOD FOR PRODUCING RESIN MOLDING DIE, RESIN MOLDING DIE, RESIN MOLDING DIE SET, METHOD FOR PRODUCING MICROCHIP SUBSTRATE, AND METHOD FOR PRODUCING MICROCHIP USING SAID DIE
Document Type and Number:
WIPO Patent Application WO/2012/124449
Kind Code:
A1
Abstract:
A method for producing a resin molding die (13) for molding a first substrate (2) having a flow path (2b) and a through-hole (2a), wherein a base die (10) having a concave part (10b) corresponding to the flow path (2b) and a through-hole (10a) corresponding to through-hole (2a) and deeper than the concave part (10b) is prepared, the base die (10) is subjected to electroforming with a first material and is then subjected to electroforming with a second material which is different from the first material, and a protruding part for forming through-hole (10a) by removing the first material that was electrodeposited on through-hole (10a) is formed. The first material has a smaller electroforming stress than the second material, the first material exerts a higher adhesiveness with regard to the base die than the second material, and the second material is harder than the first material.
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Inventors:
GOSHIMA TAKEHIKO (JP)
Application Number:
PCT/JP2012/054502
Publication Date:
September 20, 2012
Filing Date:
February 24, 2012
Export Citation:
Assignee:
KONICA MINOLTA ADVANCED LAYERS (JP)
GOSHIMA TAKEHIKO (JP)
GOSHIMA TAKEHIKO (JP)
International Classes:
B29C33/38; B29C45/00; G01N37/00; B29L31/00
Domestic Patent References:
| WO2009119441A1 | 2009-10-01 |
Foreign References:
| JP2006006286A | 2006-01-12 | |||
| JP2006509649A | 2006-03-23 | |||
| JPH06128788A | 1994-05-10 | |||
| JPH06158381A | 1994-06-07 | |||
| JP2008137280A | 2008-06-19 |
Other References:
See also references of EP 2687348A4
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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Claims: