Title:
METHOD FOR PRODUCING RESIN MOLDING MATERIAL FOR SEMICONDUCTOR SEALING, METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205892
Kind Code:
A1
Abstract:
Provided is a method for producing a resin molding material for semiconductor sealing, the method being capable of further reducing the content of electroconductive foreign matter. Also provided are a method for producing a semiconductor package and a method for producing a semiconductor device. The method for producing a resin molding material for semiconductor sealing comprises spraying and drying a mixture containing a thermosetting resin, a filler, and a solvent.
Inventors:
URASAKI NAOYUKI (JP)
Application Number:
PCT/JP2021/012551
Publication Date:
October 14, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08J3/12; C08K3/013; C08L101/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019193959A1 | 2019-10-10 | |||
| WO2013024740A1 | 2013-02-21 |
Foreign References:
| KR20170010577A | 2017-02-01 | |||
| JPH0525324A | 1993-02-02 | |||
| JP2011252042A | 2011-12-15 | |||
| JP2011252041A | 2011-12-15 | |||
| JP2006294677A | 2006-10-26 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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