Title:
METHOD FOR PRODUCING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2010/024292
Kind Code:
A1
Abstract:
Disclosed is a method for producing a resin sheet wherein the ends of a resin sheet can be cut without generating chips because the opposite ends of a resin sheet are cut using an ultrasonic cutter. Since the resin at the cut portion can be rendered soft by confining the temperature at the cut portion of the resin sheet within a preset temperature range, the sheet can be cut without generating chips even if the sheet has a thickness of 1 mm or more. Even a resin sheet of PMMA can be cut without generating chips.
Inventors:
HAYASHI TAKAHIRO (JP)
SANO YOSHIHIKO (JP)
SANO YOSHIHIKO (JP)
Application Number:
PCT/JP2009/064861
Publication Date:
March 04, 2010
Filing Date:
August 26, 2009
Export Citation:
Assignee:
FUJIFILM CORP (JP)
HAYASHI TAKAHIRO (JP)
SANO YOSHIHIKO (JP)
HAYASHI TAKAHIRO (JP)
SANO YOSHIHIKO (JP)
International Classes:
B26D1/02; B26D3/00; B26D7/08; B29C43/24; B29C48/305; B29C48/92; B29C48/08; B29L7/00
Foreign References:
| JP2002292715A | 2002-10-09 | |||
| JP2002144287A | 2002-05-21 | |||
| JP2007216482A | 2007-08-30 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
Kenzo Matsuura (JP)
Download PDF: