Title:
METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/059448
Kind Code:
A1
Abstract:
The present invention provides a method for producing a resist pattern, said method enabling the achievement of a fine resist pattern having high heat resistance, wherein a dilute weak alkaline developer solution is able to be used. The present invention specifically provides a method for producing a resist pattern, said method comprising: a coating film formation step wherein a coating film is formed on a base material; a light exposure step wherein the coating film is exposed to light; and a development step wherein the coating film after the light exposure step is developed by means of a dilute weak alkaline developer solution. With respect to this method for producing a resist pattern, the coating film contains: a novolac-type phenolic resin (A) which uses, as essential reactant materials, an aldehyde compound and a phenolic hydroxyl group-containing compound that contains an aromatic compound (a) represented by general formula (1), wherein 80% by mole or more of constituent units derived from the phenolic hydroxyl group-containing compound are constituent units (a) derived from the aromatic compound (a); and a sensitizing agent (B).
Inventors:
IMADA TOMOYUKI (JP)
NAGATA HIROHITO (JP)
NAGATA HIROHITO (JP)
Application Number:
PCT/JP2021/031290
Publication Date:
March 24, 2022
Filing Date:
August 26, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/20; G03F7/023; G03F7/20; G03F7/32
Domestic Patent References:
| WO2019239784A1 | 2019-12-19 |
Foreign References:
| JP2007304592A | 2007-11-22 | |||
| JP2002169277A | 2002-06-14 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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