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Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND FILM-LIKE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/171544
Kind Code:
A1
Abstract:
This method for producing a semiconductor device comprises: a first wire bonding step wherein a first semiconductor element is electrically connected onto a substrate by means of a first wire; a pressure bonding step wherein a second semiconductor element is pressure bonded to the substrate by means of an adhesive that has thermosetting properties; and a heat and pressure application step wherein the adhesive is cured by heating the adhesive in a pressurized atmosphere after the pressure bonding step. By undergoing the heat and pressure application step, at least one of the first semiconductor element and at least a part of the first wire is embedded in the cured adhesive. The melt viscosity of the adhesive at 120°C before curing is 1,000-3,000 Pa·s.

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WO/2019/020716DECORATIVE PART FOR A VEHICLE, AND PROCESS FOR MANUFACTURING A DECORATIVE PART
JP2002164470SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Inventors:
NAKAMURA YUKI (JP)
OHKUBO KEISUKE (JP)
KAYA MICHIKO (JP)
YAMANAKA DAISUKE (JP)
YAHATA TATSUYA (JP)
Application Number:
PCT/JP2018/009043
Publication Date:
September 12, 2019
Filing Date:
March 08, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/56; C09J7/00; C09J201/00; H01L21/50; H01L21/52; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Foreign References:
JP2015198117A2015-11-09
JP2014175459A2014-09-22
JP2016139757A2016-08-04
JP2014011257A2014-01-20
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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