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Patent Searching and Data


Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/111498
Kind Code:
A1
Abstract:
Disclosed is a method for producing a semiconductor device, said method comprising: a step for forming a thin film, which is different from a silicon oxide film, on a substrate by feeding a treatment gas to inside of a treatment vessel housing the substrate; a step for removing deposits including the thin film, which is attached inside the treatment vessel, said removal being performed by feeding a fluorine-containing gas to inside of the treatment vessel once the step for forming a thin film has been performed a predetermined number of times; and a step for forming a silicon oxide film, which has a predetermined film thickness, inside of the treatment vessel by alternately feeding a silicon-containing gas, and an oxygen-containing gas and a hydrogen-containing gas, to inside of the treatment vessel which has been heated following the removal of deposits and is at a pressure that is less than atmospheric pressure.

Inventors:
AKAE NAONORI (JP)
MURAKAMI KOTARO (JP)
HIROSE YOSHIRO (JP)
KAMEDA KENJI (JP)
Application Number:
PCT/JP2011/053508
Publication Date:
September 15, 2011
Filing Date:
February 18, 2011
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC (JP)
AKAE NAONORI (JP)
MURAKAMI KOTARO (JP)
HIROSE YOSHIRO (JP)
KAMEDA KENJI (JP)
International Classes:
H01L21/316; C23C16/44; H01L21/31
Domestic Patent References:
WO2007111348A12007-10-04
Foreign References:
JP2006165317A2006-06-22
Attorney, Agent or Firm:
YUI Tohru et al. (JP)
Oil well 透 (JP)
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Claims: