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Patent Searching and Data


Title:
METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/042864
Kind Code:
A1
Abstract:
This method for producing a semiconductor substrate comprises the following steps. While measuring the outer diameter of a wire wherein diamond abrasive grains are fixed to a core wire, a semiconductor is sliced with the wire. A condition for slicing the semiconductor is adjusted on the basis of the measured outer diameter.

Inventors:
MATSUMOTO, Naoki (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
MATSUSHIMA, Akira (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
Application Number:
JP2017/024308
Publication Date:
March 08, 2018
Filing Date:
July 03, 2017
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
H01L21/304; B24B27/06; B24B49/12; B28D5/04
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Central Tower, 2-7 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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