Title:
METHOD FOR PRODUCING SEMICONDUCTOR WIRING LINE
Document Type and Number:
WIPO Patent Application WO/2010/084844
Kind Code:
A1
Abstract:
Disclosed is a method for producing a Cu-based wiring line in a semiconductor device, wherein a Cu-Ti alloy is directly buried in a recess that is formed in an insulating film on a semiconductor substrate. The method is characterized in that the Cu-Ti alloy is formed by sputtering and contains not less than 0.5% by atom but not more than 3.0% by atom of Ti, and that a step wherein the Cu-Ti alloy is heated under the heating conditions specified below is performed when or after the Cu-Ti alloy is buried in the recess. Consequently, a Cu-based wiring line exhibiting a high performance (low electrical resistivity) and high reliability (high EM resistance) can be obtained, for example, in a semiconductor device such as an Si semiconductor device which is typified by an ULSI (ultra large scale integrated circuit). (Heating conditions) Heating temperature: 350-600°C Heating time: 10-120 min Temperature increase rate from room temperature to the above-mentioned heating temperature: 10°C/min or more Oxygen partial pressure in heating atmosphere: from 1 × 10-7 to 1 × 10-4 atom
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Inventors:
ONISHI Takashi (())
大西 隆 (())
MIZUNO Masao (())
水野 雅夫 (())
SAKAMOTO Masayuki (())
坂本 真之 (())
SATO Taiki (())
大西 隆 (())
MIZUNO Masao (())
水野 雅夫 (())
SAKAMOTO Masayuki (())
坂本 真之 (())
SATO Taiki (())
Application Number:
JP2010/050514
Publication Date:
July 29, 2010
Filing Date:
January 18, 2010
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (10-26, Wakinohama-cho 2-chome Chuo-ku, Kobe-sh, Hyogo 85, 〒6518585, JP)
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町二丁目１０番２６号 Hyogo, 〒6518585, JP)
ONISHI Takashi (())
大西 隆 (())
MIZUNO Masao (())
水野 雅夫 (())
SAKAMOTO Masayuki (())
坂本 真之 (())
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町二丁目１０番２６号 Hyogo, 〒6518585, JP)
ONISHI Takashi (())
大西 隆 (())
MIZUNO Masao (())
水野 雅夫 (())
SAKAMOTO Masayuki (())
坂本 真之 (())
International Classes:
H01L21/3205; C23C14/34; C23C14/58; H01L21/285; H01L21/768; H01L23/52
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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