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Patent Searching and Data


Title:
METHOD OF PRODUCING SENSOR DEVICE AND SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/002233
Kind Code:
A1
Abstract:
Disclosed is a method of producing a sensor device and a sensor device that prevent the corrosion of metal electrodes of a sensor due to humid ambient air, and that prevent the sensor from warping due to a resin seal, thereby reducing the effects on the sensor characteristics. The method of producing the sensor device involves: a fixed section, a movable section positioned on the inside of the fixed section, a flexible section connecting the fixed section and the movable section, and a sensor having a plurality of metal electrodes, are disposed on a substrate; the plurality of metal electrodes of the sensor and a plurality of terminals of the substrate are electrically connected by bonding wires; and areas that are connected with the bonding wires of a plurality of metal electrodes of the sensor are covered with a resin in such a manner that a portion of the bonding wires between the plurality of metal electrodes and the plurality of terminals is exposed.

Inventors:
TAKANO Takamasa (1-1-1, Ichigaya Kagacho, Shinjuku-k, Tokyo 01, 〒1628001, JP)
Application Number:
JP2011/064313
Publication Date:
January 05, 2012
Filing Date:
June 22, 2011
Export Citation:
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Assignee:
DAI NIPPON PRINTING Co., Ltd. (1-1-1, Ichigaya Kagacho Shinjuku-k, Tokyo 01, 〒1628001, JP)
大日本印刷株式会社 (〒01 東京都新宿区市谷加賀町一丁目一番一号 Tokyo, 〒1628001, JP)
International Classes:
G01P15/08; B81B3/00; B81C1/00; G01P15/12; H01L21/60; H01L29/84
Attorney, Agent or Firm:
Takahashi, Hayashi and Partner Patent Attorneys, Inc. (Sonpo Japan Kamata Building 9F, 5-24-2 Kamata Ota-k, Tokyo 52, 〒1440052, JP)
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Claims: