Title:
METHOD FOR PRODUCING SILICON CARBIDE COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2016/098681
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide, stably and by an inexpensive method, a silicon carbide composite material that is lightweight and has high thermal conductivity as well as a low coefficient of thermal expansion close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipation components that are required to be free of warping, such as heat sinks. The present invention is a method for producing a silicon carbide composite material obtained by impregnating a porous silicon carbide molded article with a metal having aluminum as a main component, wherein the method for producing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the method for producing a silicon carbide composite material is characterized in that the wet molding method is a wet press method, and is a wet casting method.
Inventors:
MIYAKAWA TAKESHI (JP)
GOTO DAISUKE (JP)
GOTO DAISUKE (JP)
Application Number:
PCT/JP2015/084653
Publication Date:
June 23, 2016
Filing Date:
December 10, 2015
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C04B35/565; B22D19/00; C04B38/00; C04B41/85; C04B41/88; H01L23/373
Foreign References:
| JP2000169267A | 2000-06-20 | |||
| JP2001334517A | 2001-12-04 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Sonoda and the Kobayashi patent business corporation (JP)
Sonoda and the Kobayashi patent business corporation (JP)
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