Title:
METHOD FOR PRODUCING SLIGHTLY OXIDIZED COPPER-CONTAINING PARTICLE, AND COPPER PARTICLE COATED WITH SLIGHTLY OXIDIZED COPPER
Document Type and Number:
WIPO Patent Application WO/2024/048662
Kind Code:
A1
Abstract:
A method for producing a slightly oxidized copper-containing particle having slightly oxidized copper, which is at least one among Cu64O and Cu8O, on the surface thereof, the method comprising: preparing a raw material particle having, at least on the surface thereof, copper oxide including at least one among CuO and Cu2O; and mixing the raw material particle with a solution containing an amine-based compound and a complex forming agent, and then adding a reductant to the resultant to allow a reaction in an oxygen-containing atmosphere.
Inventors:
YONEZAWA TETSU (JP)
TSUKAMOTO HIROKI (JP)
TSUKAMOTO HIROKI (JP)
Application Number:
PCT/JP2023/031573
Publication Date:
March 07, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
UNIV HOKKAIDO NAT UNIV CORP (JP)
International Classes:
B22F1/14; B22F1/00; B22F1/16; B22F7/08
Foreign References:
| JP2020100893A | 2020-07-02 |
Other References:
TOKURA RINTARO, TSUKAMOTO HIROKI, TOKUNAGA TOMOHARU, NGUYEN MAI THANH, YONEZAWA TETSU: "The role of surface oxides and stabilising carboxylic acids of copper nanoparticles during low-temperature sintering", MATERIALS ADVANCES, vol. 3, no. 12, 20 June 2022 (2022-06-20), pages 4802 - 4812, XP093112033, ISSN: 2633-5409, DOI: 10.1039/D1MA01242H
米澤徹 ほか, 低温焼成システム構築に向けたCuOx微酸化物系の構築, 第29回マイクロエレクトロニクスシンポジウム論文集, 2019, vol. 29, pp. 147-149, (YONEZAWA, Tetsu et al. CuOx Particle Systems for Low Temperature Sintering. Proceedings of Microelectronics Symposium 29.)
米澤徹 ほか, 低温焼成システム構築に向けたCuOx微酸化物系の構築, 第29回マイクロエレクトロニクスシンポジウム論文集, 2019, vol. 29, pp. 147-149, (YONEZAWA, Tetsu et al. CuOx Particle Systems for Low Temperature Sintering. Proceedings of Microelectronics Symposium 29.)
Attorney, Agent or Firm:
YAMAO, Norihito (JP)
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