Title:
METHOD FOR PRODUCING SOLDER ELECTRODE AND USE OF SAME
Document Type and Number:
WIPO Patent Application WO/2019/146428
Kind Code:
A1
Abstract:
The present invention is a method for producing a solder electrode, which is characterized by comprising: a step (1) for forming a coating film of a photosensitive resin composition on a substrate that has an electrode pad; a step (2) for forming a solder resist which has an opening in a region that corresponds to the electrode pad by selectively exposing the coating film to light and subsequently developing the coating film; a step (3) for forming a lift-off resist on the solder resist, said lift-off resist having an opening in a region that corresponds to the opening of the solder resist; a step (4) for forming a metal film on the inner wall of the opening of the solder resist; a step (5) for removing the lift-off resist; and a step (6) for filling the inside of the opening of the solder resist with a molten solder by an injection molding method. According to a method for producing a solder electrode of the present invention, a solder electrode such as a micro bump that is suited to a specific purpose is able to be produced by desirably filling a resist opening with a molten solder when the micro bump is formed by an IMS method.
Inventors:
HASEGAWA KOUICHI (JP)
OOKITA KENZOU (JP)
HIRAI TSUYOSHI (JP)
OOKITA KENZOU (JP)
HIRAI TSUYOSHI (JP)
Application Number:
PCT/JP2019/000638
Publication Date:
August 01, 2019
Filing Date:
January 11, 2019
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/60; G03F7/20; G03F7/26; G03F7/40; H05K3/34; G03F7/027; G03F7/038
Foreign References:
| JP2013187254A | 2013-09-19 | |||
| US9859241B1 | 2018-01-02 | |||
| JP2016208001A | 2016-12-08 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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