METHOD FOR PRODUCING STACKED COIL DEVICE

WIPO Patent Application WO/2013/134894

A1

Disclosed is a method for producing a stacked coil device. The stacked coil device involved comprises a stacked body formed by stacking a coil-forming conductor and an insulator. The production method comprises the following steps: A. producing a sheet of a ceramic insulating layer; B. forming a sheet of a ceramic insulating layer having electrically conducting through-holes; C. forming a coil layer sheet having a coil conductor, so that the coil conductor is embedded in the sheet of the ceramic insulating layer; D. stacking the sheet of the ceramic insulating layer and the coil layer sheet having the coil conductor in a pre-determined sequence and cutting off same, so as to obtain the stacked body; E. removing bonding material components from the cut-off stacked body, and sintering this stacked body; and F. forming external electrodes at the two ends of the stacked body. The method for producing the stacked coil device can conveniently produce stacked coil devices of power type with low DC resistances and without defects such as delamination, cracking and air gaps.

JPH07183143	DC REACTOR AND NOISE ESTIMATING METHOD THEREOF
JPH0521230	CHIP-LIKE INDUCTOR AND ITS MANUFACTURE
JP3645471	INSULATION TREATMENT FOR INSULATOR

LI YOUYUN (CN)
LU DAFU (CN)
ZHANG YANG (CN)
YUAN CONG (CN)

PCT/CN2012/000366

September 19, 2013

March 23, 2012

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SHENZHEN SUNLORD ELECTRONICS (CN)
LI YOUYUN (CN)
LU DAFU (CN)
ZHANG YANG (CN)
YUAN CONG (CN)

H01F41/00

CN1781166A	2006-05-31
JPH03219605A	1991-09-27
CN101556854A	2009-10-14

SHENZHEN ZHONGZHI PATENT & TRADEMARK AGENT CO., LTD. (CN)
深圳市中知专利商标代理有限公司 (CN)

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