METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

Title:

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/216763

Kind Code:

A1

Abstract:

This method for producing a structure (1) wherein base materials (10, 20) are bonded by atomic diffusion comprises: a step for applying a liquid resin (11a) to the surface of the base material (10); a step for smoothing the surface of the liquid resin (11a) by means of the surface tension of the liquid resin (11a); a step for forming a resin layer (11) by curing the liquid resin (11a); a step for forming a metal thin film (12) on the surface of the resin layer (11); a step for forming a metal thin film (21) on the surface of the base material (20); and a step for bringing the metal thin film (12) of the base material (10) and the metal thin film (21) of the base material (20) into close contact with each other, thereby bonding the metal thin film (12) of the base material (10) and the metal thin film (21) of the base material (20) with each other by atomic diffusion. Consequently, the present invention enables bonding by means of atomic diffusion even in cases where the thin film formation surface of a member is not smooth.

Inventors:

EGUCHI YUJI (JP)
SEYAMA KOHEI (JP)
NAKAMURA TOMONORI (JP)
KIKUCHI HIROSHI (JP)
SHIMATSU TAKEHITO (JP)
UOMOTO MIYUKI (JP)

Application Number:

PCT/JP2018/019972

Publication Date:

November 29, 2018

Filing Date:

May 24, 2018

Export Citation:

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Assignee:

SHINKAWA KK (JP)
UNIV TOHOKU (JP)

International Classes:

H01L21/52; B23K20/00; B23K20/24

Foreign References:

US20120305298A1	2012-12-06
JP2015106677A	2015-06-08
JP2013168503A	2013-08-29

Other References: