Title:
METHOD FOR PRODUCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/071132
Kind Code:
A1
Abstract:
Disclosed is a method for providing a structure This method for producing a structure includes: a first step for preparing a first structure which comprises a first adherend, a second adherend, and an adhesive part that bonds the first adherend to the second adherend, wherein the adhesive part contains a cured product of a curable composition containing a compound A having two or more thiol groups, a compound B having two or more functional groups able to react with thiol groups, and a photo-radical generator, and the compound A and/or the compound B have a disulfide bond in the molecule; and a second step for obtaining a second structure by heating the first structure so as to volatilize at least a part of the photo-radical generator contained in the adhesive part.
Inventors:
MIYAMOTO YUKI (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
WADA MASAYUKI (JP)
SAKAMOTO KEIICHI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/034977
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J201/02; C08G18/38; C08G75/045; C09J11/06
Domestic Patent References:
| WO2022080405A1 | 2022-04-21 | |||
| WO2022043158A1 | 2022-03-03 | |||
| WO2023167067A1 | 2023-09-07 | |||
| WO2023276773A1 | 2023-01-05 |
Foreign References:
| JP2010168452A | 2010-08-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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