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Title:
METHOD FOR PRODUCING SUBSTRATE FOR FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225825
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for forming a resin thin film laminate that makes it possible to preserve the exceptional performance attributes of exceptional heat resistance, low retardation, exceptional flexibility, and exceptional transparency, said resin thin film laminate being applied to a plastic thin film having exceptional performance as a base film of a flexible device substrate such as a flexible display substrate that can be easily peeled from a glass carrier. A method for producing a resin thin film laminate, said resin thin film laminate being characterized in that after a peeling layer is formed on a support substrate using a peeling-layer-forming composition containing a heat resistant polymer and an organic solvent, a resin thin film is formed on the peeling layer using a resin thin film-forming composition containing a heat resistant polymer and an organic solvent, and the peeling layer and the resin thin film are subsequently peeled from the support substrate as a single entity, said method being further characterized in that silicon dioxide particles having an average particle diameter of 100 nm or less as calculated from the specific surface area measured by nitrogen adsorption are incorporated in substantially only the resin thin film-forming composition.

Inventors:
EBARA KAZUYA (JP)
YE CHEN JIA (TW)
Application Number:
PCT/JP2018/021885
Publication Date:
December 13, 2018
Filing Date:
June 07, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
B29C41/22; B32B27/20; B32B27/34; C08G73/10
Domestic Patent References:
WO2017057741A12017-04-06
WO2018124006A12018-07-05
Foreign References:
US20130161864A12013-06-27
JP2010111853A2010-05-20
JP2017047684A2017-03-09
JP2012158149A2012-08-23
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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