Title:
METHOD FOR PRODUCING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGES
Document Type and Number:
WIPO Patent Application WO/2022/059167
Kind Code:
A1
Abstract:
The present invention discloses a method for producing a substrate material for semiconductor packages, said method comprising a step wherein the temperature of a multilayer body, which comprises a metal foil, one or more sheets of a prepreg, and another metal foil sequentially stacked in this order, is increased to a hot pressing temperature, while applying a pressure to the multilayer body. The prepreg contains an inorganic fiber base material and a thermosetting resin composition. The content of the thermosetting resin composition is from 40% by mass to 80% by mass based on the mass of the prepreg. In the step wherein the temperature of the multilayer body is increased to a hot pressing temperature, while applying a pressure to the multilayer body, the multilayer body is heated under such conditions that the minimum melt viscosity of the prepreg is 5,000 Pa·s or less.
Inventors:
MITSUKURA KAZUYUKI (JP)
OTAKE SHUNSUKE (JP)
TAKAHASHI MASAKI (JP)
FUJITA HIROAKI (JP)
SHIMAOKA SHINJI (JP)
OTAKE SHUNSUKE (JP)
TAKAHASHI MASAKI (JP)
FUJITA HIROAKI (JP)
SHIMAOKA SHINJI (JP)
Application Number:
PCT/JP2020/035462
Publication Date:
March 24, 2022
Filing Date:
September 18, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/12; H05K1/03
Domestic Patent References:
| WO2019230943A1 | 2019-12-05 |
Foreign References:
| JP2016060870A | 2016-04-25 | |||
| JP2016050294A | 2016-04-11 | |||
| JP2017008174A | 2017-01-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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