METHOD FOR PRODUCING SUBSTRATE AND SUPERCONDUCTIVE WIRE ROD

WIPO Patent Application WO/2011/004684

A1

Disclosed is a substrate producing method comprised of a process for preparing a substrate wherein a nickel layer (3) is formed on a copper layer (2) by a plating method, a process for heat-treating the nickel layer (3) at 800 to 1,000°C, and a process for epitaxially growing an intermediate layer (4) on the nickel layer (3) after the process for heat-treating the nickel layer (3). A substrate wherein the orientation and the flatness of the surface of the nickel layer (3) can be improved, and a method for producing the same can be provided.

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OTA, Hajime (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
太田　肇 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社　大阪製作所内 Osaka, 〒5540024, JP)
KONISHI, Masaya (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)

JP2010/060102

January 13, 2011

June 15, 2010

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SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
TOYO KOHAN CO., LTD. (2-12, Yonbancho Chiyoda-k, Tokyo 47, 〒1028447, JP)
東洋鋼鈑株式会社 (〒47 東京都千代田区四番町２番地１２ Tokyo, 〒1028447, JP)
OTA, Hajime (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)

H01B13/00; H01B12/06; H01F6/06

FUKAMI, Hisao et al. (Fukami Patent Office, p.c. Nakanoshima Central Tower, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)

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