Title:
METHOD FOR PRODUCING TRANSMISSION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/162367
Kind Code:
A1
Abstract:
A method for producing a transmission substrate according to the present invention produces a plurality of transmission substrates from a panel that has a copper foil on the surface, the plurality of transmission substrates each having a transmission path. This method for producing a transmission substrate comprises: a resist formation step in which a photoresist is formed on the copper foil; a light exposure step in which the photoresist is irradiated with light through a photomask; a resist removal step in which either a portion that is irradiated with the light or a portion that is not irradiated with the light in the photoresist is removed; and an etching step in which a portion of the copper foil, the portion having been exposed by the resist removal step, is subjected to wet etching with use of an etching liquid. With respect to this method for producing a transmission substrate, the photomask comprises a pattern that is used for the purpose of forming transmission paths, which are respectively comprised in the plurality of transmission substrates, such that the transmission paths extend along each other; respective portions of the copper foil around the plurality of transmission paths that are formed by the etching step are formed to be removed or left by the etching step so that portions where the copper foil remains and portions where the copper foil does not remain are not mingled; and in the etching step, the etching liquid moves along the transmission paths, which are formed by the etching step, with respect to the panel.
Inventors:
TANAKA YUYA (JP)
MIYAGAWA YUTA (JP)
MIYAGAWA YUTA (JP)
Application Number:
PCT/JP2022/042376
Publication Date:
August 31, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
International Classes:
H05K3/06; H01P3/08; H01Q1/38; H05K3/00
Domestic Patent References:
| WO2020031615A1 | 2020-02-13 |
Foreign References:
| JP2004140587A | 2004-05-13 | |||
| JP2003198097A | 2003-07-11 | |||
| JP2005285884A | 2005-10-13 | |||
| JP2016046376A | 2016-04-04 | |||
| JP2013026401A | 2013-02-04 | |||
| JP2019212657A | 2019-12-12 | |||
| JP2008172602A | 2008-07-24 |
Attorney, Agent or Firm:
SHIMIZU, Satoshi et al. (JP)
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