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Title:
METHOD FOR PRODUCING WAFER LENS MEMBER, METHOD FOR PRODUCING IMAGE-CAPTURING LENS, METHOD FOR PRODUCING IMAGE-CAPTURING MODULE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE MOUNTED WITH IMAGE-CAPTURING MODULE
Document Type and Number:
WIPO Patent Application WO/2011/136139
Kind Code:
A1
Abstract:
Disclosed is a method for producing an image-capturing lens, wherein the method is provided with a curing step for filling and curing a photo curable resin between a molding die having a lens-forming molding surface and one surface of a substrate, a releasing step for releasing, and a post-curing step for post-curing the lens portion formed on the substrate to progress the curing of the resin. The post-curing step is provided with a first post-curing step performed at a temperature from the glass-transition temperature (Tg) of the resin to Tg+100°C for 0.5 to 2 hours, and a second post-curing step performed at a temperature lower than the Tg and lower than the post-curing temperature in the first post-curing step by 25°C or more for 3 to 6 hours.

Inventors:
HARA AKIKO (JP)
Application Number:
PCT/JP2011/059916
Publication Date:
November 03, 2011
Filing Date:
April 22, 2011
Export Citation:
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Assignee:
KONICA MINOLTA OPTO INC (JP)
HARA AKIKO (JP)
International Classes:
B29C39/10; B29C39/38; G02B3/00; G02B7/02; G02B13/00; G02B13/18; B29L11/00; H04N5/225
Domestic Patent References:
WO2010032511A12010-03-25
Foreign References:
JP2006239977A2006-09-14
JP2009098506A2009-05-07
JP2009100350A2009-05-07
JP2004163490A2004-06-10
JP2010224118A2010-10-07
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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Claims: