Title:
METHOD FOR PRODUCTION OF COPPER ALLOY FOR ELECTRONIC MATERIAL
Document Type and Number:
WIPO Patent Application WO/2008/041696
Kind Code:
A1
Abstract:
Disclosed is a copper alloy for an electronic material, which has a satisfactory balance among strength, electric conductivity and bending workability to be used as a material for a terminal, a connector, a switch or a relay. Specifically disclosed is a copper alloy for an electronic material, which comprises 1.00 to 2.50 mass% of Co and 0.20 to 0.70 mass% of Si, with the remainder being Cu and unavoidable impurities, and which has a mass-based concentration ratio between Co and Si (a Co/Si ratio) satisfying the following formula: 3.5≤Co/Si≤5 and an electric conductivity of 55% IACS or greater, preferably 60% IACS or greater. Preferably, the copper alloy may contain Cr in an amount of 0.05 to 0.50 mass%, have a content of carbon (an unavoidable impurity) of 50 ppm or less, and further contain at least one element selected form Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag in an amount of 0.001 to 0.300 mass%. Also disclosed is a method for producing the alloy, which comprises the steps of conducting melting/casting and subsequently conducting hot rolling and cold rolling, wherein a thermal treatment for heating to 700 to 1050˚C and then cooling at a rate of 10˚C/sec. is conducted prior to the final cold rolling procedure.
Inventors:
KUWAGAKI HIROSHI (JP)
ERA NAOHIKO (JP)
ERA NAOHIKO (JP)
Application Number:
PCT/JP2007/069269
Publication Date:
April 10, 2008
Filing Date:
October 02, 2007
Export Citation:
Assignee:
NIPPON MINING CO (JP)
KUWAGAKI HIROSHI (JP)
ERA NAOHIKO (JP)
KUWAGAKI HIROSHI (JP)
ERA NAOHIKO (JP)
International Classes:
C22C9/06; C22F1/08; H01B1/02; H01R13/03; C22F1/00
Foreign References:
| JPH0136198C | ||||
| JPS62180025A | 1987-08-07 | |||
| JPH02277735A | 1990-11-14 | |||
| JPS63307232A | 1988-12-14 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (13-11 Nihonbashi 3-chom, Chuo-ku Tokyo, JP)
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