METHOD FOR THE PRODUCTION OF SEPARATE MICROMECHANICAL PARTS ARRANGED ON A SILICON SUBSTRATE, AND PARTS MADE THEREWITH

WIPO Patent Application WO/2009/141194

A3

A method for producing separate micromechanical parts arranged on a silicon substrate (1) encompasses the following steps: a) separation trenches (7) are formed on the substrate by means of a deep anisotropic plasma etching process; b) the zone (9, 12) of the silicon substrate (1) that forms the bottom of separation trenches (6) is irradiated with laser light (11) such that the silicon substrate (1) changes from a crystalline state into an at least partially amorphous state in said zone (9, 12); c) mechanical stresses are induced in the substrate (1). In one embodiment, caverns (2) are etched at the same time as the separation trenches (6) are etched. The etching depths can be controlled using the RIE lag effect.

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LAERMER FRANZ (DE)
TEEFFELEN KATHRIN (DE)
LEINENBACH CHRISTINA (DE)

PCT/EP2009/054037

October 07, 2010

April 03, 2009

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BOSCH GMBH ROBERT (DE)
LAERMER FRANZ (DE)
TEEFFELEN KATHRIN (DE)
LEINENBACH CHRISTINA (DE)

B81C1/00

US20040110359A1	2004-06-10
US20060141760A1	2006-06-29

AMER M S ET AL: "Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers", APPLIED SURFACE SCIENCE, ELSEVIER, AMSTERDAM, NL LNKD- DOI:10.1016/J.APSUSC.2004.08.029, vol. 242, no. 1-2, 31 March 2005 (2005-03-31), pages 162 - 167, XP025284852, ISSN: 0169-4332, [retrieved on 20050331]

ROBERT BOSCH GMBH (Stuttgart, DE)

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