Title:
METHOD FOR PRODUCTION OF SILVER FINE POWDER COVERED WITH ORGANIC SUBSTANCE, AND SILVER FINE POWDER
Document Type and Number:
WIPO Patent Application WO/2008/149870
Kind Code:
A1
Abstract:
Disclosed is a method for producing a silver fine powder covered with an organic
substance, which involves the step of mixing the following components (i) to
(iii) with one another: (i) a solution which comprises a liquid organic medium
(A) and a silver particle dispersed in the liquid organic medium (A), wherein
the silver particle is covered with a protective material (X1) composed
of an organic compound having an unsaturated bond and a molecular weight of 150
to 1000; (ii) a protective material (X2) which comprises an organic
compound having fewer carbon atoms in the carbon skeleton than that in the organic
compound constituting the protective material (X1); and (iii) a liquid
organic medium (B) in which the solubility of the protective material (X1)
is higher than that in the liquid organic medium (A); thereby proceeding the dissolution
of the protective material (X1) in the liquid organic medium (B) and
the adhesion of the protective material (X2) onto the surface of the
silver particle. According to the method, it can be achieved to produce a silver
fine powder which is covered with a protective material having a low molecular
weight and which can be fired at a largely reduced temperature, in an industrially
advantageous manner and in a large quantity.
More Like This:
Inventors:
SATO, Kimitaka (14-1, Sotokanda 4-chome,Chiyoda-k, Tokyo 21, 1010021, JP)
佐藤 王高 (〒21 東京都千代田区外神田4丁目14-1 DOWAエレクトロニクス株式会社内 Tokyo, 1010021, JP)
JEYADEVAN, Balachandran (Tohoku University6-6-20, Aza Aoba, Aramaki,Aoba-ku, Sendai-sh, Miyagi 79, 9808579, JP)
佐藤 王高 (〒21 東京都千代田区外神田4丁目14-1 DOWAエレクトロニクス株式会社内 Tokyo, 1010021, JP)
JEYADEVAN, Balachandran (Tohoku University6-6-20, Aza Aoba, Aramaki,Aoba-ku, Sendai-sh, Miyagi 79, 9808579, JP)
Application Number:
JP2008/060240
Publication Date:
December 11, 2008
Filing Date:
May 28, 2008
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Soto-kanda 4-chomeChiyoda-k, Tokyo 21, 1010021, JP)
DOWAエレクトロニクス株式会社 (〒21 東京都千代田区外神田4丁目14番1号 Tokyo, 1010021, JP)
TOHOKU UNIVERSITY (1-1 Katahira 2-chome, Aoba-ku Sendai-shi, Miyagi 12, 9800812, JP)
国立大学法人 東北大学 (〒12 宮城県仙台市青葉区片平2丁目1番1号 Miyagi, 9800812, JP)
SATO, Kimitaka (14-1, Sotokanda 4-chome,Chiyoda-k, Tokyo 21, 1010021, JP)
DOWAエレクトロニクス株式会社 (〒21 東京都千代田区外神田4丁目14番1号 Tokyo, 1010021, JP)
TOHOKU UNIVERSITY (1-1 Katahira 2-chome, Aoba-ku Sendai-shi, Miyagi 12, 9800812, JP)
国立大学法人 東北大学 (〒12 宮城県仙台市青葉区片平2丁目1番1号 Miyagi, 9800812, JP)
SATO, Kimitaka (14-1, Sotokanda 4-chome,Chiyoda-k, Tokyo 21, 1010021, JP)
International Classes:
B22F1/02; B22F9/24; H01B13/00
Attorney, Agent or Firm:
WADA, Kenji (Room 601, Lions Mansion Ichigaya8-10, Sumiyoshi-cho,Shinjuku-k, Tokyo 65, 1620065, JP)
Download PDF:
