Title:
METHOD FOR PROTECTING APPARATUS FROM ETCHING SUBSTANCES AND METHOD FOR FORMING OXIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/055124
Kind Code:
A1
Abstract:
Disclosed are a method for protecting an apparatus from etching substances and a method for forming an oxide film. The method for protecting an apparatus from etching substances according to the present invention comprises the steps of: (a) forming a protecting film on an exposed surface of the apparatus; (b) forming a seasoning film on the protecting film; (c) performing a deposition process on a wafer introduced into the apparatus with the protecting film and the seasoning film; (d) removing a deposition film and the seasoning film by using a first etching substance, the deposition film having been formed on the seasoning film of the apparatus during the deposition process; and (e) removing the protecting film by using a second etching substance.
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Inventors:
KIM KWANG-KI (KR)
LIM BI-O (KR)
LIM BI-O (KR)
Application Number:
PCT/KR2021/009671
Publication Date:
March 17, 2022
Filing Date:
July 26, 2021
Export Citation:
Assignee:
TES CO LTD (KR)
International Classes:
H01J37/32; C23C16/44
Foreign References:
| KR20170009843A | 2017-01-25 | |||
| KR20170134234A | 2017-12-06 | |||
| JP2010205854A | 2010-09-16 | |||
| US20190271076A1 | 2019-09-05 | |||
| KR101614273B1 | 2016-04-21 |
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
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