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Title:
METHOD OF PROTECTING SEMICONDUCTOR DEVICE AND PROTECTION APPARATUS FOR SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO2004008500
Kind Code:
A3
Abstract:
A protection apparatus for a semiconductor device includes a DC power source (VB), a load/RL), a semiconductor device arranged between the DC power source and the load and switches the load between a driving state and a stopping state, a comparator (MP1) comparing a voltage drop across the semiconductor device with a predetermined reference voltage, and a cut off unit cutting a conduction of the semiconductor device between the DC power source and the load when the voltage drop is greater than the predetermined reference voltage. A constant of the circuit element is set so that the reference voltage is not greater than a critical voltage. The critical voltage is a product of the on-resistance of the semiconductor device when its channel temperature is at an upper limit of the permissible temperature, and a minimum current value which causes the channel temperature to reach the upper limit of the permissible temperature by the self-heating due to Joule heat.

Inventors:
OSHIMA SHUNZOU (JP)
Application Number:
JP0308786W
Publication Date:
May 21, 2004
Filing Date:
July 10, 2003
Export Citation:
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Assignee:
YAZAKI CORP (JP)
OSHIMA SHUNZOU (JP)
International Classes:
G05F1/10; H02H5/04; H03K17/082; H03K17/14; H03K17/687; H03K17/08; (IPC1-7): H01L21/00
Domestic Patent References:
WO2002097940A22002-12-05
Foreign References:
US6166530A2000-12-26
EP1115203A12001-07-11
US6335577B12002-01-01
US6552889B12003-04-22
Other References:
See also references of EP 1522089A2
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