Title:
METHOD FOR PURIFYING COMPOUND THAT GENERATES ACID WHEN IRRADIATED WITH ACTIVE LIGHT OR RADIATION, METHOD FOR PRODUCING ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/255585
Kind Code:
A1
Abstract:
The present invention provides a method for purifying a compound that generates an acid when irradiated with active light or radiation, said method being capable of reducing the content of metal impurities, while having excellent recoverability and low LWR change rate (%) that is calculated by the formula below. LWR change rate (%) = (|(LWR of pattern that uses active light sensitive or radiation sensitive resin composition containing unpurified acid diffusion control agent) – (LWR of pattern that uses active light sensitive or radiation sensitive resin composition containing acid diffusion control agent purified by means of acidic aqueous solution)|/(LWR of pattern that uses active light sensitive or radiation sensitive resin composition containing unpurified acid diffusion control agent)) × 100 The present invention also provides: a method for producing an active light sensitive or radiation sensitive resin composition, said method comprising the above-described purification method; a pattern forming method; and a method for producing an electronic device. A method for purifying a compound that generates an acid when irradiated with active light or radiation, said method comprising a purification step wherein a compound that generates an acid when irradiated with active light or radiation, while having a conjugate acid that has an acid dissociation constant of -2.0 or more but less than 5.0 is cleaned by means of an acidic aqueous solution, with the value obtained by subtracting the above-described acid dissociation constant from the pH of the acidic aqueous solution being -1.0 or more. Meanwhile, in cases where the conjugate acid of the compound has two or more acid dissociation constants, one or more of the two or more acid dissociation constants is -2.0 or more but less than 5.0.
Inventors:
UEMURA MINORU (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
YAMAMOTO KEI (JP)
OU KEIYU (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
YAMAMOTO KEI (JP)
OU KEIYU (JP)
Application Number:
PCT/JP2020/018893
Publication Date:
December 24, 2020
Filing Date:
May 12, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C381/12; C07C303/44; C07C309/10; C07C309/12; C07C309/17; C07C309/19; C07C309/65; C07C311/51; C07D275/06; C09K3/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2009037981A1 | 2009-03-26 |
Foreign References:
| JP2010222327A | 2010-10-07 | |||
| JP2010275296A | 2010-12-09 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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