Title:
METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/093223
Kind Code:
A1
Abstract:
Provided is a polishing composition used for polishing the surface of a semiconductor wafer in order to planarize the surface of a semiconductor having steps and thereby reclaim the semiconductor wafer. The polishing composition comprises at least an agent for eliminating steps, which is adsorbed to the surface of the semiconductor wafer and acts to prevent etching of the base portion of the steps on said surface during polishing. The agent for eliminating steps is, for instance, a water-soluble polymer or surfactant, and more specifically, a polyvinyl alcohol, polyvinyl pyrrolidone, polyethylene glycol, cellulose, carboxylic acid-type surfactant, sulfonic acid-type surfactant, phosphoric acid ester-type surfactant, or oxyalkylene polymer.
Inventors:
MORINAGA, Hitoshi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
森永 均 (〒02 愛知県清須市西枇杷島町地領二丁目１番地１ 株式会社 フジミインコーポレーテッド 内 Aichi, 〒4528502, JP)
森永 均 (〒02 愛知県清須市西枇杷島町地領二丁目１番地１ 株式会社 フジミインコーポレーテッド 内 Aichi, 〒4528502, JP)
Application Number:
JP2011/051090
Publication Date:
August 04, 2011
Filing Date:
January 21, 2011
Export Citation:
Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
株式会社 フジミインコーポレーテッド (〒02 愛知県清須市西枇杷島町地領二丁目１番地１ Aichi, 〒4528502, JP)
MORINAGA, Hitoshi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
株式会社 フジミインコーポレーテッド (〒02 愛知県清須市西枇杷島町地領二丁目１番地１ Aichi, 〒4528502, JP)
MORINAGA, Hitoshi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
ONDA, Hironori et al. (12-1, Ohmiya-cho 2-chome Gifu-sh, Gifu 31, 〒5008731, JP)
Claims:
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