Title:
METHOD OF RECOVERING MATERIAL AND MATERIAL RECOVERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/038665
Kind Code:
A1
Abstract:
A method of material recovery in which a glass substrate having an adherend attached to
at least one major surface thereof is provided and the adherend is removed from the
glass substrate to thereby recover the glass substrate. The method includes the
step (A) of breaking portion of the glass substrate into glass splinters and the
step (B) of bombarding the adherend with the glass splinters to thereby detach and
remove the adherend from the glass substrate. By virtue of this method, there can
be attained not only removal of the adherend attached to the glass substrate at
low cost but also enhancement of glass substrate yield.
Inventors:
IWAMOTO HIROSHI
TANI YOSHIYUKI
TANI YOSHIYUKI
Application Number:
PCT/JP2007/068680
Publication Date:
April 03, 2008
Filing Date:
September 26, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
IWAMOTO HIROSHI
TANI YOSHIYUKI
IWAMOTO HIROSHI
TANI YOSHIYUKI
International Classes:
B09B3/00; B09B5/00; B24C1/08; H01J9/50; H01J11/02
Foreign References:
JP2002196299A | 2002-07-12 | |||
JP2004313850A | 2004-11-11 | |||
JP2000141224A | 2000-05-23 |
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (OAP TOWER 8-30, Tenmabashi 1-chome, Kita-ku, Osaka-sh, Osaka 26, JP)
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