METHOD OF RECOVERING SILICON-CONTAINING MATERIAL

WIPO Patent Application WO/2007/108308

A1

A method by which a silicon-containing material from which a coolant has been removed is recovered. The method of recovering a silicon-containing material is characterized by comprising the steps of: removing beforehand a water-soluble coolant from a spent slurry resulting from a silicon wafer production process which comprises the water-soluble coolant, abrasive grains, and silicon particles to thereby obtain a solid matter; extracting from the solid matter the water-soluble coolant remaining in the solid matter with a low-boiling organic solvent which has compatibility with the water-soluble coolant and has a lower boiling point than the water-soluble coolant; removing by centrifugal separation the low-boiling organic solvent used in the extraction; and recovering the solid matter obtained by the centrifugal separation.

KAJIMOTO KIMIHIKO
HOJO YOSHIYUKI
TANAKA MASAYA (JP)
TAKAHASHI KATSUMI (JP)
OOBA TOMOYUKI (JP)
HIRAKAWA HIROYUKI (JP)

PCT/JP2007/054200

September 27, 2007

March 05, 2007

Click for automatic bibliography generation  

SHARP KK (JP)
ISHIKAWAJIMA HANYOKI SERVICE C (JP)
KAJIMOTO KIMIHIKO
HOJO YOSHIYUKI
TANAKA MASAYA (JP)
TAKAHASHI KATSUMI (JP)
OOBA TOMOYUKI (JP)
HIRAKAWA HIROYUKI (JP)

C01B33/02; B01D11/04; B01D21/26

JP2002293528A	2002-10-09
JP2001278612A	2001-10-10
JP2005330149A	2005-12-02

NOGAWA, Shintaro (Minamimorimachi Park Bldg., 1-3, Nishitenma 5-chome,, Kita-ku, Osaka-sh, Osaka47, JP)

View/Download PDF      PDF Help

Previous Patent: TRANSMISSION POWER CONTROLLER, MOBILE STATION, AND TRANSMISSION POWER CONTROL METHOD AND PROGRAM

Next Patent: GAME MACHINE