Title:
METHOD FOR REGENERATING ABRASIVE SLURRY
Document Type and Number:
WIPO Patent Application WO/2017/098986
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for regenerating an abrasive slurry whereby an abrasive slurry showing a high abrasion speed can be efficiently regenerated. The method according to the present invention for regenerating an abrasive slurry, which comprises polishing a subject to be polished, said subject comprising silicon oxide as a main component, with the use of an abrasive slurry containing abrasive grains and multiple kinds of additives, then collecting the abrasive slurry and regenerating the collected abrasive slurry, is characterized by involving a regeneration step wherein, while maintaining the abrasive concentration (mass%) within a range of 0.2-3000% relative to the abrasive concentration (mass%) of the abrasive slurry before using in polishing the subject, additive(s) having a molecular weight of 500 or greater and additive(s) adsorbed by the abrasive grains, from among the additives contained in the collected abrasive slurry, are collected together with the abrasive grains.
Inventors:
INUI CHIE (JP)
MAEZAWA AKIHIRO (JP)
NAGAI YUUKI (JP)
HIRAYAMA NATSUMI (JP)
MAEZAWA AKIHIRO (JP)
NAGAI YUUKI (JP)
HIRAYAMA NATSUMI (JP)
Application Number:
PCT/JP2016/085679
Publication Date:
June 15, 2017
Filing Date:
December 01, 2016
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B24B57/02
Domestic Patent References:
| WO2013099143A1 | 2013-07-04 |
Foreign References:
| JP5843036B1 | 2016-01-13 | |||
| JPH06254764A | 1994-09-13 | |||
| JP2003205460A | 2003-07-22 | |||
| JP2002114967A | 2002-04-16 | |||
| JP2013222863A | 2013-10-28 | |||
| JP2002118082A | 2002-04-19 | |||
| JP2002201462A | 2002-07-19 | |||
| JP2004269577A | 2004-09-30 | |||
| JP2004273547A | 2004-09-30 |
Other References:
See also references of EP 3388195A4
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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