Title:
METHOD FOR REMOVING ACCUMULATED SOLDER FROM PROBE CARD PROBING FEATURES
Document Type and Number:
WIPO Patent Application WO1999035505
Kind Code:
A3
Abstract:
A method for removing deposits from a probing feature (72) of a probe card (70), the method includes the step of exposing the probing feature of a probe card to a composition (76) that chemically reacts with the deposits on the probing feature to remove the deposits from the probing feature while not substantially effecting the material comprising the probing feature.
Inventors:
SHELL MELISSA K (US)
YOSHIMOTO RICHARD S (US)
YOSHIMOTO RICHARD S (US)
Application Number:
PCT/US1998/027393
Publication Date:
April 06, 2000
Filing Date:
December 21, 1998
Export Citation:
Assignee:
INTEL CORP (US)
SHELL MELISSA K (US)
YOSHIMOTO RICHARD S (US)
SHELL MELISSA K (US)
YOSHIMOTO RICHARD S (US)
International Classes:
C23G1/02; G01R1/06; G01R3/00; G01R31/28; H01L21/66; G01R1/067; G01R1/073; (IPC1-7): H01L21/00; H01L21/66; C23G1/02
Foreign References:
US5814158A | 1998-09-29 | |||
US5288332A | 1994-02-22 | |||
US3615950A | 1971-10-26 | |||
US4314855A | 1982-02-09 | |||
US5657394A | 1997-08-12 |
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