Title:
METHOD FOR REMOVING DEFECTS FROM PELLICLE FILM FOR EXTREME ULTRAVIOLET LITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2022/260296
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a pellicle film used in extreme ultraviolet lithography and, more specifically, to a method for removing defects from a pellicle film for extreme ultraviolet lithography. The present invention provides the method for removing defects from a pellicle film for extreme ultraviolet lithography, comprising the steps of: a) checking the type of defect formed in a pellicle film; b) determining the specifications of a laser for defect removal on the basis of the type of defect; and c) removing the defect by irradiating the defect with the laser for defect removal. According to the present invention, defects, such as particles that cannot be cleaned off from a pellicle film for extreme ultraviolet lithography, can be easily removed.
Inventors:
SHIN DONG YOUNG (KR)
KWON HYUK MIN (KR)
JEON SUNG CHUL (KR)
KWON HYUK MIN (KR)
JEON SUNG CHUL (KR)
Application Number:
PCT/KR2022/006855
Publication Date:
December 15, 2022
Filing Date:
May 13, 2022
Export Citation:
Assignee:
FINE SEMITECH CORP (KR)
International Classes:
G03F1/62; G03F1/22
Foreign References:
| KR20100067628A | 2010-06-21 | |||
| JP2008268041A | 2008-11-06 | |||
| US20080241711A1 | 2008-10-02 | |||
| KR20200074228A | 2020-06-24 | |||
| JP2000009654A | 2000-01-14 |
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
Download PDF: