| CLAIMS
1} A method of removing a high pressure laminate top cover (11), from a composite panel (10) consisting of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13), for use In a raised floor covered by such composite panels (10), |is characterized in which the method comprises the steps of: Identifying a piece of the composite panel (10) in the raised floor, placing a heater plate device {20), which matches substantially the shape and size of the composite panel (10), over the composite panel (10); switching on a power source connected to the heater plate device (20) for a predetermined time; and removing the high pressure laminate top cover (11) from the composite panel (10) thereafter.
2)- A heater plate device (20) suitable for use to remove a high pressure laminate top cover (11), from a composite panel (10) consisting of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13). for use in a raised floor covered by such composite panels (10), is characterized In which the heater plate device (20) comprises a metallic plate (21) and a non metallic handle (22); the metallic plate (21) assumes substantially the shape and size of the composite panel (10); and the metallic plate (21) is electrically connected to a power source with the assistance of cables or wiring and a power control box (30), whereby the intermediate glue layer (12) Is softened due to heating by the healer plate device (20) after the power source has been switched on for a predetermined time. |
A METHOD OF REWOVlNG A HIGH PRESSURE LAMINATE TOP COVER FROM A COMPOSITE PANEL IN A RAISED FLOOR AND A HEATER PlATE DEVICE THEREOF
TECHNICAL FIELD Tha present invention relates generally to a composite panel in a raised floor. It relates specifically to a method of removing a high pressure laminate top cover from the composite panel, with the assistance of a heater plate device, and the heater plate device thereof.
BACKGROUND ART The concept of raised floor was developed Initially to meet the needs of the etectronic and computer Industries. Cabte management and heat load distribution consideration become key issues in the design of new building and renovation of existing rooms. Raised floor concept is implemented in the form of modular panels built on raised pedestals. The environment becomes neat, which enhances productivity, and provides flexibility and ease of cable upgrading work.
A composite pane! in a raised floor normally consists, of a high pressure laminate top cover, an intermediate glue layer and a support floor board. Current methods of removing the high pressure laminate top cover employs a chisel-like tooling to scrap off the used top cover, or using a flame to scorch directly the used top cover. These are tedious, destructive and stow. Current methods also damage the high pressure laminate top cover which often was strongly bonded with the support floor board due to aging and hardening of the intermediate glue layer over time.
SUMMARY OF THE INVENTION
The present Invention has therefore a primary object to remove the high pressure laminate top cover from a composite panel in a raised floor. The composite panel consists of , a high pressure laminate top cover, an Intermediate glue layer and a support floor board.
Another object of the present invention is to provide a cost effective end environment-friendly method of removing the high pressure laminate top cover from the composite panel.
To achieve the above objects, a heater pfate device, which comprises a
5 metallic plate and a πon-metaliic handle, Is used. The metallic plate assumes substantially the shape and size of the composite panel. The metallic pfate is electrically connected to a power source with the assistance of cables or wiring and a power control box. The intermediate glue layer is softened due to heating by the heater plate device after the power source has been switched0 on.
The removal method comprises the steps of; identifying a piece of the composite panel in a raised floor; placing a heater plate device, which matches substantially the shape and size of the composite panel, over trie composite panel; switching on a power source connected to the heater plate device fora predetermined ϋme; and removing the high pressure laminate top cover from the composite panel thereafter.
BRIEF DESCRIPTION OF THE DRAWINGS In order that the present Invention may be more readily understood, the following description is given, by way of example, of one specific embodiment of a heater plate device. The heater plate device is used to soften an intermediate glue layer in between a high pressure laminate top cover and a support floor board, making up the composite panel In a raised floor.
Figure 1 shows a cross-sectional view of a composite panel in a raised floor, comprising a hfgh pressure faminate top cover, an intermediate glue layer and a support floor board.
Figure 2 shows a perspective view of a heater ptate device connected to a - power source, with the assistance of cables, wiring and a power control box.
Figure 3 illustrates how the heater plate device being placed over the composite panel, as shown In Figure 1.
DETAILED DESCRIPTION
As seen In Figure 1, a piece of composite panel (10) comprises a high pressure laminate top cover (11), an intermediate glue layer {12} and a support floor board (13). Composite panels.(10) form a raised floor, being placed on vertical pedestals (not shown) supporting the composite panels (10). .
According to the present Invention as shown in Figure 2, a heater plate device (20) comprises a metallic plate (21) and a non-metaltic handle (22), with electrical circuitry connecting the metallic plate (21) to a power source, with the assistance of cables or wiring and a power control box (30), The power source is of a single phase or three-phase. The metallic plate (21) assumes substantially the shape and size of the composite panel (10). The power control box (30) is equipped with a temperature controller device (32) and a power on-off switch (31). A thermocouple (23) is further attached to the metallic plate (21 ). The electrical circuitry is of known technology.
To service a composite panel (10) as shown In Figure 3, the composite panel (10) is first identified from the raised floor, The composite panel (10) may be removed or left in situ. The heater plate device (20) is next placed over the composite panel (10), The power source is switched on for a predetermined time, The intermediate glue layer (12) will be softened subsequently. The used high pressure laminate top cover (11) can then be removed easily. The used high pressure laminate top cover (11) will not be dry and brittle as a result of elevated heat transferred from the heater plate device (20). A lot of used high pressure laminate top covers (11) can be saved from damage during refurbishment work. The used high pressure laminate top covers (11) can be recycled and reused for other applications. The present invention is therefore cost effective and environment-friendly.