Title:
METHOD FOR REMOVING RESIDUAL LAYER, DEVICE FOR REMOVING RESIDUAL LAYER, AND DISPLAY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/221372
Kind Code:
A1
Abstract:
Provided is a method for removing a residual layer 50L of an ACF 50 attached onto an array substrate 30 of a liquid crystal panel 11, which is to be used in a liquid crystal module 1, the method comprising: a placing step for placing a metal mesh 60 on the surface of the residual layer 50L; a heating step for heating the residual layer 50L to be softened; a crimping step for crimping the metal mesh 60, which is placed on the surface of the residual layer 50L in the placing step, to the residual layer 50L softened in the heating step such that at least part of the ACF 50 that constitutes the residual layer 50L is press-fitted into pores 60A of the metal mesh 60; and a separating step for separating the metal mesh 60, in which the ACF 50 is press-fitted into the pores 60A, from the array substrate 30.
Inventors:
HIRANO TAKAAKI
Application Number:
PCT/JP2018/019982
Publication Date:
December 06, 2018
Filing Date:
May 24, 2018
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/60; G09F9/00
Foreign References:
| JP2014096531A | 2014-05-22 | |||
| JPH05109838A | 1993-04-30 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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