METHOD FOR REPAIRING 3D PRINTING SAMPLE SURFACE, AND PRESSURE DEVICE

WIPO Patent Application WO/2019/127453

A1

Provided is a method for repairing 3D printing sample surface. The method comprising: firstly, coating a layer of uncured resin liquid onto a surface of a substrate; then, exerting uniform pressure on the surface of the substrate by means of a transparent thin film, and curing the resin liquid via UV to obtain a smooth and flat resin surface while the pressure is maintained; and finally, heating and annealing the substrate to remove the internal stress of the substrate. Provided is a device for repairing a 3D printing sample surface, the device comprising an upper transparent silicone membrane (2), a base plate (7), a lower transparent silicone membrane (5) and a vacuum pump (8), wherein a cavity passing through the base plate is arranged in the base plate, the upper and lower transparent silicone membranes are respectively fixed at an upper end and a lower end of the cavity, and after the vacuum pump is started, the upper and lower transparent silicone membranes respectively compress the 3D printing sample surface coated with a layer of uncured resin liquid.

ZHANG ZHIFEI (CN)
FENG YULIN (CN)
ZHAO ZHUO (CN)
HUANG LI (CN)
HE XIAONING (CN)
FANG XUANLAI (CN)

PCT/CN2017/120114

July 04, 2019

December 29, 2017

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BMF NANO MATERIAL TECH CO LTD (CN)

B29C67/00; B33Y40/00

WO2017062857A1

2017-04-13

CN101081388A	2007-12-05
US20010043990A1	2001-11-22

SZ KINDWALF INTELLECTUAL PROPERTY FIRM (CN)

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