METHOD FOR REPAIRING OR REINFORCING STRUCTURE USING ADHESIVE SHEET, METHOD FOR PRODUCING STRUCTURE THAT IS REPAIRED OR REINFORCED USING ADHESIVE SHEET, AND ADHESIVE SHEET

Title:

METHOD FOR REPAIRING OR REINFORCING STRUCTURE USING ADHESIVE SHEET, METHOD FOR PRODUCING STRUCTURE THAT IS REPAIRED OR REINFORCED USING ADHESIVE SHEET, AND ADHESIVE SHEET

Document Type and Number:

WIPO Patent Application WO/2015/159733

Kind Code:

A1

Abstract:

[Problem] To provide a method for repairing or reinforcing a structure, which is reduced in work load even in cases where an adhesive sheet is cured by irradiation of ionizing radiation such as sunlight, and which is capable of maintaining strong adhesion between the structure and the adhesive sheet. [Solution] A method for repairing or reinforcing a structure using an adhesive sheet, which is characterized by comprising: a step for preparing an adhesive sheet having an adhesive layer that contains at least a curable resin composition, the curing of which is accelerated by irradiation of ionizing radiation, and a curing assistant that generates a basic substance by irradiation of ionizing radiation; a step for bonding the adhesive sheet to the surface of a structure; and a step for curing the adhesive layer of the adhesive sheet, while maintaining the adhesive layer in an exposed state.

Inventors:

HOSHI KENTARO (JP)
TANIGUCHI TAKAHISA (JP)
TACHIKAWA TOMOYUKI (JP)

Application Number:

PCT/JP2015/060577

Publication Date:

October 22, 2015

Filing Date:

April 03, 2015

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD (JP)

International Classes:

C09J5/00; C09D7/12; C09D163/00; C09J5/02; C09J7/10; C09J11/06; C09J201/00; E04G23/02

Domestic Patent References:

WO2014007341A1

2014-01-09

Foreign References:

JPH08218646A	1996-08-27
JP2013049844A	2013-03-14
JP2011117129A	2011-06-16
JP2013087149A	2013-05-13

Other References: