METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW

WIPO Patent Application WO/2010/010657

A1

Disclosed is a method for resuming the operation of a wire saw characterized in that a work is cut while the axial displacement of a grooved roller and the temperature of the work during cutting are measured and recorded, the axial displacement of the grooved roller and the temperature of the work are regulated, to be the same as the displacement and temperature recorded when the cutting of the work is interrupted, by supplying the grooved roller and the work, respectively and independently, with temperature-controlled temperature regulation media after the cutting of the work is interrupted and before the cutting of the work is resumed, and then the cutting of the work is resumed.  A method for resuming the operation of a wire saw and a wire saw, wherein cutting can be resumed and completed without causing any problem with the quality of a product wafer, are thereby provided by preventing the nano-topography from deteriorating after processing even if the cutting of a work is interrupted in the middle due to the disconnection of a wire, or the like, when such a work as a semiconductor ingot is cut by means of a wire saw.

KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)

JP2009/002910

January 28, 2010

June 25, 2009

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Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)

B24B27/06; B28D5/04

YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)

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