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Patent Searching and Data


Title:
METHOD FOR SCRIBING FRAGILE MATERIAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/054123
Kind Code:
A1
Abstract:
Provided is a method for scribing a fragile material substrate, whereby it becomes possible to prolong the life of diamond that scribes the fragile material substrate. The method for scribing a fragile material substrate is a method for scribing a fragile material substrate (G) along a scheduled scribing line (L), the method comprising placing a sheet (S) containing a polymeric compound on the fragile material substrate (G) for 48 to 1000 hours, removing the sheet (S), pressing a diamond-made point (P) of a scribing tool (1) onto the scheduled scribing line (L), and moving the fragile material substrate (G) and the scribing tool (1) relatively to each other to scribe the fragile material substrate (G).

Inventors:
MATSUBUSHI TAISEI (JP)
NAKAJIMA MASAO (JP)
Application Number:
PCT/JP2022/035208
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
B28D5/00; B26F3/00; C03B33/027; C03B33/037
Foreign References:
JP2005075482A2005-03-24
JP2010132347A2010-06-17
JP2014004812A2014-01-16
JP2017065245A2017-04-06
Attorney, Agent or Firm:
YANO INTERNATIONAL PATENT ATTORNEYS OFFICE, P.C. (JP)
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