METHOD FOR SCRIBING SUBSTRATE OF FRAGILE MATERIAL

WIPO Patent Application WO/2010/038563

A1

Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the substrate, an outline scribe line consisting of a closed curve constituting the outline of a product to be cut out, and forming an auxiliary scribe line for assisting division on the outside of the outline scribe line, wherein auxiliary scribe lines (12a-12d, 13a-13d) are directed in the tangential direction of outline scribe lines (11a-11c) and a non-scribe region having a distance of 2 mm or less is left between the auxiliary scribe line and the outline scribe line.

KAWABATA, Takashi (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
川畑　孝志 (〒44 大阪府吹田市南金田２丁目１２番１２号　三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)
SAKAGUCHI, Ryota (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)

JP2009/064705

April 08, 2010

August 24, 2009

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MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
KAWABATA, Takashi (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
川畑　孝志 (〒44 大阪府吹田市南金田２丁目１２番１２号　三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)

B28D5/00; C03B33/04

KASHIMA, Yoshio (SHINSEI & Co. 409 Yuni Higashi-Umeda, 7-2 Minami Ogi-machi, Kita-ku, Osaka-cit, Osaka 52, 〒5300052, JP)

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