Title:
METHOD FOR SEALING PACKAGE, AND SEALING PASTE
Document Type and Number:
WIPO Patent Application WO/2015/190501
Kind Code:
A1
Abstract:
A method for sealing a package by putting a lid on the package and bonding the lid to the package with a brazing alloy, the method comprising: a paste application step in which a sealing paste containing a low-melting-point metal powder having a melting point less than 300°C and a high-melting-point metal powder, as another powder, that has a melting point of 300°C or higher is applied to a surface of the lid; a preliminary heat treatment step in which the low-melting-point metal powder in the sealing paste applied to the lid is melted to form a brazing-material precursor; and an alloying step in which the brazing-material precursor is heated and kept molten until the lid is bonded to the package or the brazing-material precursor is heated and melted when the lid is bonded to the package, thereby alloying the brazing-material precursor.
Inventors:
ISHIKAWA MASAYUKI (JP)
YAMAMOTO YOSHIFUMI (JP)
YAMAMOTO YOSHIFUMI (JP)
Application Number:
PCT/JP2015/066672
Publication Date:
December 17, 2015
Filing Date:
June 10, 2015
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/02
Foreign References:
JP2003163299A | 2003-06-06 | |||
JPH0524943A | 1993-02-02 | |||
JP2007059746A | 2007-03-08 | |||
JP2009183008A | 2009-08-13 | |||
JP2011222663A | 2011-11-04 |
Attorney, Agent or Firm:
AOYAMA, MASAKAZU (JP)
Aoyama Masakazu (JP)
Aoyama Masakazu (JP)
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