Title:
METHOD FOR SEALING SUBSTRATES WHILE STACKING
Document Type and Number:
WIPO Patent Application WO/2005/041156
Kind Code:
A1
Abstract:
While interlocking with the operation of an electrostatic attraction means (5b) for releasing an upper substrate (A), gas (G) is jetted from the back side of the upper substrate and injected forcibly between the electrostatic attraction face (5b1) of an upper holding plate (1) and the back surface of the upper substrate. Since adhesion state of the electrostatic attraction face and the substrate surface is broken and they are stripped from each other, electrostatic attraction between them is attenuated forcibly and eliminated. Since a falling force or a falling acceleration acts forcibly on a lower substrate (B) due to the pressure of injected gas, the upper substrate adheres onto the lower substrate instantaneously. The upper substrate is moved, while being held by the electrostatic attraction means (5b), onto the lower substrate without varying the attitude, and bonded and stacked thereon while being sealed. The upper substrate can thereby be dropped forcibly while being aligned regardless of variation in the electrostatic attraction being released.
Inventors:
TAKEFUSHI NORIYUKI (JP)
KOGA YASUYUKI (JP)
OSHIMA HIDEKI (JP)
INABA RYOICHI (JP)
KOGA YASUYUKI (JP)
OSHIMA HIDEKI (JP)
INABA RYOICHI (JP)
Application Number:
PCT/JP2003/013536
Publication Date:
May 06, 2005
Filing Date:
October 23, 2003
Export Citation:
Assignee:
SHINETSU ENG CO LTD (JP)
TAKEFUSHI NORIYUKI (JP)
KOGA YASUYUKI (JP)
OSHIMA HIDEKI (JP)
INABA RYOICHI (JP)
TAKEFUSHI NORIYUKI (JP)
KOGA YASUYUKI (JP)
OSHIMA HIDEKI (JP)
INABA RYOICHI (JP)
International Classes:
G02F1/13; G02F1/1339; G09F9/00; G09F9/30; H01J9/26; H01J11/46; H01J11/48; (IPC1-7): G09F9/30; G02F1/13; G02F1/1339; H01J9/26; H01J11/00; H05B33/14
Foreign References:
| JP2002090703A | 2002-03-27 | |||
| JP2002311440A | 2002-10-23 | |||
| JPH06235896A | 1994-08-23 |
Attorney, Agent or Firm:
Hosoi, Sadayuki (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo, JP)
Chonan, Mikio (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Ishiwatari, Hidefusa (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Nakamura, Masamichi (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Chonan, Mikio (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Ishiwatari, Hidefusa (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Nakamura, Masamichi (14-7 Hakusan 5-chom, Bunkyo-ku Tokyo)
Download PDF: