Title:
METHOD FOR SEGMENTING SUBSTRATE HAVING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2019/082736
Kind Code:
A1
Abstract:
Provided is a method with which it is possible to suitably segment a substrate having a metal film. A method for segmenting a substrate having a metal film, the method comprising: a step for forming a scribe line by scribing a first-main-surface side, on which no metal film is provided, at a prescribed position intended for segmenting, and extending a vertical crack in the substrate interior along the position intended for segmenting; a step for further extending the vertical crack by bringing a breaking bar into contact with the substrate having a metal film from a second-main-surface side, on which a metal film is provided, and thereby segmenting a portion other than the metal film at the position intended for segmenting; and a step for segmenting the metal film at the position intended for segmenting by bringing the breaking bar into contact with the substrate having a metal film from the first-main-surface side.
Inventors:
MURAKAMI KENJI (JP)
Application Number:
PCT/JP2018/038482
Publication Date:
May 02, 2019
Filing Date:
October 16, 2018
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
H01L21/301; B28D5/00
Foreign References:
| JP2014065633A | 2014-04-17 | |||
| JP2015083336A | 2015-04-30 | |||
| JP2017041525A | 2017-02-23 | |||
| JPS56148842A | 1981-11-18 | |||
| JP2012146879A | 2012-08-02 |
Other References:
See also references of EP 3703106A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF:
Previous Patent: HOT WATER HEATING SYSTEM
Next Patent: AXIAL-FLOW FLUID MACHINE AND TIP CLEARANCE MEASURING METHOD THEREFOR
Next Patent: AXIAL-FLOW FLUID MACHINE AND TIP CLEARANCE MEASURING METHOD THEREFOR