Title:
METHOD FOR SELECTIVELY BONDING POLYMER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/174464
Kind Code:
A1
Abstract:
Provided is a method for selectively bonding a polymer substrate. A mask pattern and plasma treatment can be used to carry out selective interfacial bonding between the polymer substrate and parylene layer, and a fluid can be injected into the non-bonding areas to form a three-dimensional structure.
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Inventors:
KIM SO HEE (KR)
CHOU NAM SUN (KR)
MOON HYUN MIN (KR)
CHOU NAM SUN (KR)
MOON HYUN MIN (KR)
Application Number:
PCT/KR2018/003014
Publication Date:
September 27, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
DAEGU GYEONGBUK INST SCIENCE & TECH (KR)
International Classes:
G03F1/64; G03F1/00; G03F7/00; G03F7/16; H01L21/027; H01L21/18
Foreign References:
| KR100691732B1 | 2007-03-12 | |||
| KR20140038161A | 2014-03-28 | |||
| KR20090003517A | 2009-01-12 | |||
| KR20110003526A | 2011-01-12 | |||
| JP2005283331A | 2005-10-13 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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