Title:
METHOD FOR SEPARATING A LAYER FROM A COMPOSITE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/011372
Kind Code:
A8
Abstract:
The invention relates to a method for separating a layer (115) from a composite structure (125), the structure comprising a composite stack formed from at least a support substrate (105) which is partially transparent at a determined wavelength, the layer (115) to be separated and a separation layer (110) interposed between the support substrate and the layer to be separated, the method comprising irradiation of the separation layer (110) through the support substrate (105) by means of incident light ray (124a) at the determined wavelength in order to induce weakening or separation by exfoliation of the separation layer, the light ray being inclined so as to form an angle of incidence Θ such that θ>θmin, where θmin = sin -1((n1/no)sin(tan-1(S/2h))), n1 and n0 respectively being the refractive index of the support substrate and the refractive index of the external medium (130) in contact with the support substrate (105), from which the said ray comes, S being the width of the said ray and h being the thickness of the support substrate.
Inventors:
LANDRU DIDIER (FR)
Application Number:
PCT/IB2012/001406
Publication Date:
April 24, 2014
Filing Date:
July 18, 2012
Export Citation:
Assignee:
SOITEC SILICON ON INSULATOR (FR)
LANDRU DIDIER (FR)
LANDRU DIDIER (FR)
International Classes:
H01L21/762
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